Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe (APPLAUSE)

Period: May 2019 - April 2022

Total Budget: ~34.17M Eur

Project Coordinator: ICOS Vision Systems

Partners: 32

Countries(11): Germany, The Netherlands, Belgium, Finland, Norway, Austria, Switzerland, France, Hungary, Israel, Latvia

The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 6 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (GE Healthcare and Cardiaccs) 5. Novel manufacturing platform for optical and other MEMS requiring open access cavities (Murata) 6. Optical water measurement modules with cost-effective packaging of components (Vaisala) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.

In this project, together with 10 international partners, EDI will develop a low-cost and high-performance thermal infrared sensor, with focus on hermetic wafer level packaging. The target is a camera core capable for producing video-rate imagery with VGA resolution, and with factor 100 lower cost than state-of-the-art. The main fields of application for the camera are in thermography (Quality Assurance or Quality Control, HVAC&R), in transport (Automated Driver Assistance Systems in cars and in Unmanned Aerial Aircraft Systems) and in other surveillance, security and safety applications.

EDI will contribute to the implementation of driver(s) for ROIC digital interface and IR image pre-processing algorithms. This involves correction for spatial distortions, image colorization, digital zoom, histogram correction, image fusion, non-uniformity correction, correction for fixed pattern noise, correction for dead and hot pixels and corrections from narcissus effect. Results will be displayed via GUI-based demonstrator.

The purpose of the thermal infrared (TIR) Use Case 2 is to develop a low-cost and high-performance thermal
infrared sensor, with focus on hermetic wafer level packaging. The target is a camera core capable for
producing video-rate imagery with VGA resolution, and with factor 100 lower cost than state-of-the-art.
The main fields of application for the camera are in thermography (Quality Assurance or Quality Control,
HVAC&R), in transport (Automated Driver Assistance Systems in cars and in Unmanned Aerial Aircraft
Systems) and in other surveillance, security and safety applications.