Participation of IECS in international projects
1. Cost 229. Irregularized Digital Signal Processing in Telecommunications.
Duration: 1993 - 1994 (24 months).
2. COPERNICUS. PECO 7668 EEMCN. East European Microelectronics Cooperation Network of Support and Competence Centres of Central and Eastern European Countries.
Duration: 1993- 1996 (39 months)
Partners: 13 organizations from Bulgaria, Czech Republic, France, Estonia, Latvia, Lithuania, Poland, Slovakia, Hungary, Germany.
3. Supplementary Agreement No.2: ERBCIPD 930032 with DRL - Institute of Optoelectronics (Germany) Irregularized Signal Processing Based on Improvement of Lidar Measurement Techniques to the basic Project Improvement of Lidar Measurement Techniques for Discrimination of Polar Stratosferic Cloud and Volcanic Aerosols.
Duration: 1993 - 1994 (24 months).
4. COPERNICUS. Project CP 0536. Concerted Action for Stimulation and Support of East-West Collaborations in the Areas of Microelectronics and Signal Processing (BENEFIT).
Duration: 1993 - 1996 (36 months).
Partners: 19 organizations from Austria, Czech Republic, France, Italy, Russian Federation, Latvia, The Netherlands, Poland, Spain, Slovakia, Hungary, Germany.
5.COPERNICUS. Project No.8254. Complexity Reduced Large Aperture Arrays.
Duration: 1994 - 1996 (24 months).
Partners: Universidad Polittecnica de Catalonya (Spain), Institute of Electronics and Computer Science (Latvia), Signal Processing Institute, Ltd. (Latvia), University of Westminster (UK).
6. Programme BIOMED. European Concerted Action. Laser-Doppler Flowmetry for Microcirculatory Monitoring.
Duration: 1994 - 1995 (18 months).
Partners: 24 organizations from EU and CEEC.
7. COPERNICUS. Project CP 9401341. Parallel Computing for Real-Time High-Resolution Randomized Reconstruction of Backscattered Laser-Doppler Signals.
Duration: 1995 - 1998. (36 months).
Partners: Medizinische Universitat zu Lubeck (Germany), ISATEC Soft- und Hardware GmbH (Germany), Institute of Electronics and Computer Science (Latvia), Signal Processing Institute, Ltd. (Latvia), Industrial Institute of Electronics (Poland).
8. Information Society Technologies (IST) Programme. Project IST-1999-21004 Actions providing access to DASP technology for digital designing of Microwave and Radio Frequency IST systems (EURODASP).
Duration: 2000 - 2002 (24 months).
Partners: German Aerospace Center DLR (Germany), Institute of Electronics and Computer Science (Latvia), University of Westminster (UK), Institute of Applied Microelectronics and Computer Science, University of Rostock (Germany), SEND Signal-Elektronik und Netz-Dienste GmbH (Germany), DASP Lab Ltd. (UK)
9. Information Society Technologies (IST) Programme. Project IST-2001-34552.
Project acronym: DASPTOOL
Project full title: Development of tools for direct digital alias-free processing of RF and microwave signals with demonstrations of their application potential.
Duration: 2002 – 2005 (36 months).
Partners: Institute of Electronics and Computer Science (Coordinator), Latvia (IECS);
Lattelekom SIA, Latvia (Ltt);
Institute of Applied Microelectronics and Computer Science, University of Rostock, Germany (UoR);
Ragnar Granit Institute, Technical University of Tampere, Finland (RGI);
University of Westminster, United Kingdom (UoW);
Cybernetica AS, Estonia (Cybernetica).
10. EU Sixth Framework Programme project MODULINSPEX (NMP2-CT-2005-016882) Modular High Speed X-ray Detection and Sorting Systems for Production Process Control and Packaging Quality Control.
Duration: 2005-2008 (36 months)
Partners:Cavendish Instruments Limited, UK DETECTRONIC A/S,Denmark INNOSPEXION APS, Denmark INSTITUTE OF ELECTRONICS AND COMPUTER SCIENCE, Latvia OY AJAT LTD, Finland ZENON SA ROBOTICS AND INFORMATICS, Greece. 11. EU 7FP project „Development of Novel X-ray Inspection Systems for Fast Automated Detection of Counterfeit PCB Components” (ChipCheck, FP7 grant agreement no 262212), see www.chipcheck.eu
Duration: 24 months (2010-2012)
Partners: TWI (UK), Innospexion APS (Denmark), Accent Pro 2000 s.r.l (Romania), Computerised Information Technology Ltd (UK), Semicon Sp. z o. o.(Poland), Kentro Erevnas Technologias Kai Anaptyxis Thessalias (Greece), Surface mount and related technologies Ltd (UK), Institute of Electronics and Computer Science (Latvia)
|