The IR620 preheating platform provides a suitable and low cost method to assist when soldering or de-soldering various SMT devices while doing board rework or fabrication Incaluable when working with BGA, SOIC, QFP, PLCC style surface mount devices. The integrated ceramic heating element heats up and maintains a stable temperature. This model is designed with a microcomputer controlled closed loop PID temperature control circuit. The program cycles every 20 milliseconds to detect the actual temperature at the heating element allowing for quick and rapid recovery to the set temperature. Easy to operate with a simple front panel LED temperature display.

Device specification:
Power: 800W
Supply voltage: 230V
Temperature: max. 300 ° C
Weight: 2.8Kg